Assembly Capacity
Assembly Capacity
There are 4 SMT patch production lines equipped with new imported Samsung high speed SMT machine，fully automatic paste printing machine，ten temperature zone return furnace，AOI, SPI, x-ray and other high-end equipment.Especially good at high precision, high complexity of the board
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Component size
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03015--55*100MM
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BGA gap
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0.2MM
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IC gap
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0.18MM
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Double-sided board、Assemble circuit board、Test board、DIP、Flexible printed circuit board、Soft and hard combined board
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SMT speed
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0.1S
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Component specification
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SMT precision
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±0.05MM
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XRAY
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YES
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Laser steel mesh
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420*520MM 550*650MM 736*736MM
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PCB specification
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PCB Size
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50*50MM-610*510MM
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PCB Thickness
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0.3-6.5MM
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SMT Process Flow
SMT Process Flow
High-quality
High-quality
Production line is equipped with high-end equipment, high precision and high yield processing.Quality inspection and control at each link to avoid defective products flowing into the next link
| 1. 1st sample detection |
Detection of wrong materials, missing parts, polarity, direction, screen printing, etc., mainly used in the detection of the first part，compared with manual detection, the accuracy is higher |
| 2. SPI Device |
Detect all kinds of solder paste printing quality problems |
| 3. AOI |
Detect all kinds of problems after installation: short connection, missing material, polarity, shift, wrong parts |
| 4. Xray |
Open circuit and short circuit detection of BGA, QFN and other devices |
Processing Equipment